An intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling
Features
Real-time Temperature Monitoring
Real-time temperature display with automatic curve analysis function.
Optical Alignment System
High-definition CCD (2m pixels) digital imaging, automatic optical zoom system, manual control and laser red-dot alignment.
Rapid heating and cooling
The IR preheating zone is heated by a medium wave ceramic infrared heating plate, a multi-functional movable PCB fixing bracket, and a BGA bottom support frame with laminar integrated cooling fan.
Specification
Power Supply | AC 220V /- 10% 50/60Hz |
Power | 5.65KW (max) Top Heater: 1.45KW Bottom Heater: 1.2KW IR Preheater: 2.7KW Other: 0.3KW |
PCB Size | Max: 412 x 370 mm Min: 6 x 6 mm |
BGA Chip Size | Max: 60 x 60 mm Min: 2 x 2 mm |
IR Heater Size | 285 x 375 mm |
Temperature Sensor | 1 |
Operation Method | 7" HD Touch Screen |
Control System | Autonomous heating control system V2 |
Display System | 15" SD Industrial Display (720P) |
Alignment System | 2 million pixel SD Digital Imaging System. Automatic Optical Zoom with Laser Red-Dot Indicator |
Vacuum Adsorption | Automatic |
Alignment Accuracy | /- 0.02 mm |
Temperature Control | K-type Thermocouple Closed-Loop Control with Accuracy up to /- 3°C |
Feeding Device | No |
Positioning | V-groove with Universal Fixture |
Dimensions | 685 L x 633 W x 850 H mm |
Weight | 76kg |